Investigation of Cutting Force and the Material Removal Mechanism in the Ultrasonic Vibration-Assisted Scratching of 2D-SiCf/SiC Composites

Ultrasonic-assisted grinding (UAG) is widely used in the manufacture of hard and brittle materials. However, process removal mechanism was never elucidated its potential yet to be fully exploited. In this paper, material analyzed by ultrasonic-assisted scratching. Three distinct surfaces (S1, S2, S3) were selected on basis braided laminated structure fiber bundles. The scratching experiment carried out under different conditions, force (SF) tested surface will fluctuate periodically. Under conditions feed speeds, depths, ultrasonic amplitudes, normal (SFn) greater than tangential (SFt), average three generally S3 > S2 >S1. Among processing parameters, speed has most significant influence force, while depth little force. same cutting mode, vibration-assisted slightly lower conventional decreases first then increases with amplitude vibration. Because undergoes a fracture process, matrix torn, residues are discharged time; therefore, roughness improved.